| Features, Applications |
| Industry Standard MICROWIRE Bus Single Supply Voltage: to 5.5V for to 5.5V for to 5.5V for M93Cx6-R Dual Organization: by Word (x16) or Byte (x8) Programming Instructions that work on: Byte, Word or Entire Memory Self-timed Programming Cycle with AutoErase Ready/Busy Signal During Programming Speed: ? 1MHz Clock Rate, 10ms Write Time (Current product, identified by process identification letter ? 2MHz Clock Rate, 5ms Write Time (New Product, identified by process identification letter or S) Sequential Read Operation Enhanced ESD/Latch-Up Behaviour More than 1 Million Erase/Write Cycles More than 40 Year Data Retention Reference Part Number M93C66-R UFDFPN8 (MB) 2x3mm? (MLP) M93C46 M93C56 Reference Part Number M93C46-R TSSOP8 (DS) 3x3mm? body size (MSOP) TSSOP8 (DW) 169 mil width FEATURES SUMMARY. 1 Table 1. Figure 1. Figure 2. Table 2. Table 3. Table 4. Figure 3. Product List. 1 Packages. 1 Logic Diagram. 4 Signal Names. 4 Memory Size versus Organization. 4 Instruction Set for the M93Cx6. 4 DIP, SO, TSSOP and MLP Connections (Top View). 5 MEMORY ORGANIZATION. 5 POWER-ON DATA PROTECTION. 5 INSTRUCTIONS. 6 Table 5. Instruction Set for the M93C46. 6 Table 6. Instruction Set for the M93C56 and M93C66. 7 Table 7. Instruction Set for the M93C76 and M93C86. 7 Read. 8 Erase/Write Enable and Disable. 8 Figure 4. READ, WRITE, EWEN, EWDS Sequences. 8 Erase. 9 Write. 9 Figure 5. ERASE, ERAL Sequences. 9 Erase All. 10 Write All. 10 Figure 6. WRAL Sequence. 10 READY/BUSY STATUS. 11 COMMON I/O OPERATION. 11 CLOCK PULSE COUNTER. 11 Figure 7. Write Sequence with One Clock Glitch. 11 MAXIMUM RATING. 12 Table 8. Absolute Maximum Ratings. 12 DC AND AC PARAMETERS. 13 Table 9. Operating Conditions (M93Cx6). 13 Table 10. Operating Conditions (M93Cx6-W). 13 Table 11. Operating Conditions (M93Cx6-R). 13 Table 12. AC Measurement Conditions (M93Cx6). 14 Table 13. AC Measurement Conditions (M93Cx6-W and M93Cx6-R). 14 Figure 8. AC Testing Input Output Waveforms. 14 Table 14. Capacitance. 14 Table 15. DC Characteristics (M93Cx6, Device Grade 6). 15 Table 16. DC Characteristics (M93Cx6, Device Grade 3). 15 Table 17. DC Characteristics (M93Cx6-W, Device Grade 6). 16 Table 18. DC Characteristics (M93Cx6-W, Device Grade 3). 17 Table 19. DC Characteristics (M93Cx6-R). 17 Table 20. AC Characteristics (M93Cx6, Device Grade 3). 18 Table 21. AC Characteristics (M93Cx6-W, Device Grade 6). 19 Table 22. AC Characteristics (M93Cx6-W, Device Grade 3). 20 Table 23. AC Characteristics (M93Cx6-R). 21 Figure 9. Synchronous Timing (Start and Op-Code Input). 22 Figure 10.Synchronous Timing (Read or Write). 22 Figure 11.Synchronous Timing (Read or Write). 22 PACKAGE MECHANICAL. 23 Figure ? 8 pin Plastic DIP, 0.25mm lead frame, Package Outline. 23 Table ? 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data. 23 Figure 13.SO8 narrow ? 8 lead Plastic Small Outline, 150 mils body width, Package Outline. 24 Table 25. SO8 narrow ? 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data 24 Figure (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm?, Outline 25 Table (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm?, Data. 25 Figure ? 8 lead Thin Shrink Small Outline, 3x3mm? body size, Package Outline 26 Table ? 8 lead Thin Shrink Small Outline, 3x3mm? body size, Mechanical Data 26 Figure ? 8 lead Thin Shrink Small Outline, Package Outline. 27 Table ? 8 lead Thin Shrink Small Outline, Package Mechanical Data. 27 PART NUMBERING. 28 Table 29. Ordering Information Scheme. 28 Table 30. How to Identify Current and New Products by the Process Identification Letter. 29 REVISION HISTORY. 30 Table 31. Document Revision History. 30
|