SPECIFICATIONS
Mfr Package Description | PLASTIC, DIP-16 |
Status | Active |
JESD-30 Code | R-PDIP-T16 |
JESD-609 Code | e0 |
Number of Terminals | 16 |
Package Body Material | PLASTIC/EPOXY |
Package Code | DIP |
Package Shape | RECTANGULAR |
Package Style | IN-LINE |
Peak Reflow Temperature (Cel) | 240 |
Qualification Status | Not Qualified |
Seated Height-Max | 4.44 ?mm |
Surface Mount | NO |
Technology | CMOS |
Temperature Grade | MILITARY |
Terminal Finish | Tin/Lead (Sn80Pb20) |
Terminal Form | THROUGH-HOLE |
Terminal Pitch | 2.54 ?mm |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 |
Length | 19.175 ?mm |
Width | 7.62 ?mm |